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The different of Ag-11Au-4.5Pd and Ag-11Au-4.5Pd-0.1Y alloy bonding wire mechanical properties, fusing current and structure were analyzed by strength tester, electronic conductivity tester, and scanning electron microscope. The effects of Y on Ag-11Au-4.5Pd and Ag-11Au-4.5Pd-0.1Y alloy bonding wire ball size, bonded micro phonology and bonded strength were investigated. The results show that the...
The different of Ag-4Pd and Ag-4Pd-0.3Ru alloy bonding wire properties and structure were analyzed by scanning electron microscope, strength tester and thermal conductivity tester, the effects of Ru on Ag-4Pd alloy bonding wire ball size, bonded micro phonology and bonded strength were investigated. The results show that the thermal conductivity of Ag-4Pd alloy bonding wire decreases from 403 W/m·k...
In the study, the effects of Pd thickness on free air ball, wire elongation/strength on bonding strength and bonding interface of Pd coated copper wire bonding were discussed. It was found that the Pd thickness effects on free air ball, the free air ball will become golf ball when the Pd thickness is thin excessively, then the Pd thickness is not less than 0.47% to the wire diameter, and high tensile...
thin-film transistors (TFTs) are fabricated using as gate dielectrics. The enhancement of the electric characteristics is observed after a postannealing processing including the reduction of the threshold voltage , the increase in mobility , and the on/off ratio. The effect of the postannealing temperature on both the interfacial...
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