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The modeling, simulation, fabrication, and testing of a microchannel cooling plate for microelectronic packaging applications are described in this paper. The cooling component uses forced convection of gas injected inside 128 microchannels of 100-mu m width and 70-mu m height. The nickel-based plate is fabricated on a glass substrate using a two-layer electroforming process using UV-LIGA technology...
The thermal behavior of a micro-channel cooling device has been investigated by using two different, complementary measurement methods. The measured sample was a square nickel plate micro-cooler holding 128 micro-channels in radial arrangement. In our previous studies we used only thermal transient measurements and the structure functions method to identify the partial thermal resistance corresponding...
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