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In this paper, the method of space alternated phase shift (SAPS) megasonic technology is applied for post-etch (Bosch) TSV wafers cleaning process. The SAPS technology provides uniform sonic energy on each point of entire wafer by alternating phase of megasonic wave in the gap between a megasonic device and the wafer. For this study, 5×50 µm post-etch (Bosch) TSV wafers were used. Experimental verification...
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