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This paper presents a fundamental method to evaluate power cycle fatigue life of power device. Coupled electrical-thermal analysis is performed to obtain the distribution of temperature due to electric current. Then, thermal-mechanical analysis is carried out to calculate inelastic strain range generated in a solder joint. In addition, the fatigue evaluation for aluminum wire bonding was carried out...
This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis is performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis is carried out to calculate inelastic, aluminum wire bonding was done. Crack path simulation technique was used to evaluate total fatigue life of solder joint and...
This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis was performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis was carried out to calculate inelastic strain range generated in a solder joint. Crack path simulation technique was used to evaluate total fatigue life and rise...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
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