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In this study, the aim is to establish the efficient method of life evaluation with checking it's consistent with real test. Firstly, as to the effect of hardening rule, differences between analysis result of isotropie and that of kinematic are small and analysis time of kinematic is longer than that of isotropie. Isotropie hardening is more effective, and its utility is higher than that of kinematic...
In this study, Printed Wiring Board (PWB) specimens with Interstitial Via Hole (IVH) were exposed to thermal cycling test, and the thermal fatigue life scatter of IVH was investigated by Finite Element Analysis (FEA), taking into consideration the influence of interactions between different processes during manufacturing. Focusing on laminated structure of PWB, the FEA was conducted with detailed...
This paper presents the result of verifying Miner's law of the solder joint part by mechanical fatigue tests and FEM analysis. The author's group have studied the Manson-Coffin's law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu solder, because...
In order to identify the causes of a fracture incident that occurred on the outer ring of a cylindrical roller bearing within an air blower motor, diverse characterization analyses were conducted in this study. Metallurgical structures and chemical compositions of the bearing’s matrix materials were inspected by metallographic microscope and photoelectric direct reading spectrometer. Scanning electron...
For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal...
This paper presents the influence of the micro structure on the crack propagation in lead free solder joint. The author's group have studied the Manson-Coffin's law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu solder, because this solder is attracted...
Semiconductor component manufacturers supply to different product manufacturers in a wide range of market segments, for different end use applications. The goal of electronic component qualification is to demonstrate component reliability under operating conditions in the end product configuration. While a manufacturer may have successfully qualified an individual component, operating stresses due...
There is an increasing need to fabricate power devices that are lightweight and compact. However, reducing the weight of power devices would result in reduced stiffness, and greater compactness would result in increased current density, which, in turn, would increase the temperature of the device and cause deterioration. Thus, to realize lightweight, compact power devices with sufficient reliability,...
This paper presents the high reliability design method for lead-free solder joints on chip components, and that is able to evaluate effect of soldering process for solder joint shape. Coupled analysis of structure analysis and flow analysis was proposed for replication of solder wetting and behavior of electric components at the same time. The analysis methods enable to evaluate complex mechanism...
Recently, the SiC chip for power devices had been developed to downsize the cooling system, because the operative temperature of SiC chip can be increase to over 300°C. However it is necessary to realize low temperature mounting and high reliability in high temperature. The author's group has proposed a new method using Ag-Nano material to mount the SiC chip on a Al board. The Ag-Nano can be mounted...
This paper presents a fundamental method to evaluate power cycle fatigue life of power device. Coupled electrical-thermal analysis is performed to obtain the distribution of temperature due to electric current. Then, thermal-mechanical analysis is carried out to calculate inelastic strain range generated in a solder joint. In addition, the fatigue evaluation for aluminum wire bonding was carried out...
This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis is performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis is carried out to calculate inelastic, aluminum wire bonding was done. Crack path simulation technique was used to evaluate total fatigue life of solder joint and...
This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
This paper presents mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. The authors proposed an isothermal fatigue test method using real size solder joints to get the fatigue properties. The Manson-Coffin's law given by this method could improve the agreement between the simulation model and experimental results. Based upon the Manson-Coffin's law...
This paper focuses on the study of the drop-impact reliability of solder joints of integrated circuit components on printed circuit boards. The impact strength and impact toughness of solder alloys are investigated by performing the ball impact test (an experimental approach). For comparison with experimental results, the fracture of a single solder joint specimen is numerically simulated using the...
Since the flexural rigidity of thin semiconductor package become much lower than normal components, the warpage of the component become a much more important issue to evaluate the reliability. In this study the author's proposal a new practical shrinkage method to measure the real time curing deformation and the elastic modulus resin during the whole curing process. the thermal deformation of the...
Semiconductors are solids whose electrical conductivity is intermediate between that of a conductor and an insulator. Semiconductor devices are active devices that consume, accumulate, and discharge the supplied electric power. They are used as electronic or power devices. The former are employed in the control systems of electrical products such as mobile phones and computers, which are controlled...
This paper presents a fundamental method to evaluate thermal fatigue life of power module. Coupled electrical-thermal analysis was performed to obtain the distribution of temperature due to electric current. Then, thermo-mechanical analysis was carried out to calculate inelastic strain range generated in a solder joint. Crack path simulation technique was used to evaluate total fatigue life and rise...
This paper presents mining the worst case of thermal fatigue life of solder joints on chip components used in vehicle electronics. Typical 36 cases with various solder shapes were examined. Thermal fatigue life including not only the crack initiation but also crack propagation was evaluated by using the finite element method. Based upon the case study's results, it was found that when a crack propagates...
This paper describes the phase growth of Sn-3.0Ag- 0.5Cu solder joints by mechanical cyclic loading. The objective of this paper is to clear the influence of temperature and strain to the phase growth. It is very important to evaluate the life time of crack initiation in Sn-3.0Ag-0.5Cu solder joints under thermal cycles. A mini-lap joint type shear specimen was used to evaluate the influence of temperature...
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