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The development of automotive lighting systems with high illumination quality and high reliability is essential for driving safe and comfort. LEDs have many superiorities over the traditional light sources, such as high reliability, good color quality, long lifetime, energy and space saving, environment friendly and so on, when they are operated under an effective health management (such as thermal,...
Recently, with the increasing requirements on guaranteeing the color uniformity and improving the luminous efficacy and manufacturing efficiency, a wafer level chip scale packaging (WLCSP) technology has been developed by thermally impressing a thin multiple phosphor film on a LED wafer, then being segmented into individual LED chips. In this paper, a high power white LED Chip-on-Board (COB) module...
According to the requirements on minimizing the package size, guaranteeing the performance uniformity and improving the manufacturing efficiency in LEDs, a Chip Scale Packaging (CSP) technology has been developed to produce white LED chips by impressing a thin phosphor film on LED blue chips. In this paper, we prepared two types of phosphor-converted white LED CSPs with high color rendering index...
The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance...
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