The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
For Si dioxide-film CMP process in semiconductor manufacturing, which requires high precision, run-to-run control has been developed. The run-to-run control is a kind of repetitive control to adjust polishing time at every start of work in a work sequence. This control is based on a process model, which expresses the relation between polishing time and polished thickness. The model is non-linear for...
This paper describes a run-to-run control method based on within-wafer distribution of film-thickness and removal rate. The main feature of this method incorporates adjusting the lower and upper margin of the film-thickness after CMP. The margins represent the differences of the minimum and maximum film-thickness values from the lower and upper control limits, respectively. In order to realize this...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.