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The demand of electronic device applications for high performance, minimization and cost effectiveness has driven the highly integrated semiconductor packaging development in recent years. Embedding die technology, which reduces package height and weight, increases the functionality and density, improves electrical and thermal performance and reduces the cost effectively, is particularly attractive...
In the process of satellite network communication service transmission and distribution, due to the limitation of the system cache space can cause the congestion effect, it easily lose the data of high importance or timeliness. Aiming at the problem of network congestion effect, based on RED (Random Early Detection) algorithm, M_TSPAQM(Queue Manage Algorithm Based on Priority of Multiple Terminal...
In this paper, a self-adaptive two phase approach for large scaleoptimization is proposed. In the first phase, we design a uniformdiscrete search method which can quickly and roughly scan the searchspace and find good initial points. Thenwe continuously narrow the search space and make moreprecise search in a dynamically self-adaptive way. Inthe second phase, we design a dynamically self-adaptivegrouping...
Nowadays, fan-out package is regarded as one of the latest and most potential technologies due to lower cost, smaller and thinner form factor, better electrical performance, and better thermal performance. Compared with traditional flip chip ball grid array (FCBGA), fan-out technology eliminates many process steps such as substrate, wafer bumping, flip chip reflow, flux cleaning, underfill, etc. However,...
SNMP is currently the most widely used network management protocol which can examine the condition of network equipment and control them through visits MIB objects. It makes the network more convenient to manage while brings about new security challenges. Based on the analysis of the security threats brought by SNMP and the ways to attack a network through SNMP protocol, this paper designs several...
For the last few decades semiconductor industry has been following Moore Law effectively, which has resulted in significant miniaturization of transistors and chip logic circuitry, and the development of 3D integration technology. While due to the large size and extremely thin of chip and interposer, increasingly attention has been payed to the warpage, which was regarded not only decide the assembly...
Wafer with thicker metal is very challenge for mechanical dicing, especially the SGPC pattern in saw street. The chipping and peeling are easily happening on the SGPC pattern. In recent years, there are many effort spent on traditional sawing to process thick metal wafer. The current advanced mechanical dicing method for wafer with thick metal and narrower saw street is step cut. But the step cut...
The cooperative co-evolution framework (CC) is widely used in the large scale global optimization. It is believed that the CC framework is very sensitive to grouping strategies and the performance deteriorate if interacted variables are not correctly grouped. So many efforts have been devoted to find good ways to correctly decompose the large scale problem into smaller sub-problems so as to effectively...
In this paper a novel Geometric Programming based distributed approach is proposed which enables small cell users to optimize their downlink performance by exploiting distributed joint allocation of transmission power and subchannels. The problem is formulated to maximize the system sum capacity, specifically, the time delay is taken into as a constraint to guarantee the quality of service. Consequently,...
This chapter provides a practical overview of frequently used markers in the diagnosis and differential diagnosis of both common and rare metastatic tumors and undifferentiated neoplasms with a specific focus on epithelial/epithelioid neoplasms and their mimickers. The chapter contains 89 questions; each question is addressed with a table, a concise note, and representative pictures if applicable...
This chapter provides a practical overview of frequently used markers in the diagnosis and differential diagnosis of both common and rare neoplasms of the thyroid and parathyroid glands, with a specific focus on papillary thyroid carcinoma and its mimickers. The chapter contains 28 questions; each question is addressed with a table, concise note, and representative pictures if applicable. In addition...
Immunohistochemistry plays a crucial role in the routine practice of breast pathology. This chapter answers questions about immunohistochemistry many applications to topics including stromal invasion, columnar cell lesions, intraductal proliferations, papillary lesions, sclerosing lesions, spindle cell lesions, nipple neoplasia and Paget’s disease, fibroepithelial lesions, prognostic and predictive...
Combined quantum mechanical/molecular mechanical (QM/MM) models have been established as efficient approaches to simulate chemical reactions in complex molecular systems including enzymes. The QM/MM Hamiltonian is defined based on partitioning a molecular system into a reactive center and its surrounding, namely, the QM and MM regions. How to properly treat the QM/MM interface, which involves both...
This chapter provides a practical overview of frequently used markers in the diagnosis and differential diagnosis of both common and rare neoplasms of prostate gland with a specific focus on adenocarcinoma and its mimickers. The chapter contains 41 questions; each question is addressed with a table, concise note, and representative pictures if applicable. In addition to the literature review, the...
Although the majority of ovarian tumors are diagnosed purely on morphologic findings, this chapter identifies specific opportunities for the application of immunohistochemistry to the diagnosis of ovarian surface epithelial tumors, sex cord–stromal tumors, and germ cells tumors. This chapter addresses the use of newer markers such as SALL4 in yolk sac tumors and PAX8 in serous, clear cell and endometrioid...
Cooperative co-evolution framework is widely used in large scale optimization problems. Usually, the large scale problem is divided into smaller sub groups using black-box decomposition methods based on variable interactions. However these black-box decomposition methods have limitations in finding correct variable interactions. In this paper, a white-box decomposition method named formula based grouping...
The low-k dielectric materials in wafer fabrication are widely used. The current advanced mechanical dicing is not able to meet the requirement of low-k technology, since the low-k materials are harder and brittle. Laser dicing is developed for low-k wafer dicing. There are various laser dicing techniques in the market. Depending on the wafer thickness, laser dicing can either be a though cut or a...
This paper first briefly introduces the basic model of the FH/QPSK (Frequency-hopped Quadrature Phase Shift Keying) communication system and the interference noise model under the partial-band interference. Then it decomposes the receiver signal into direct signal component and diffuse signal component, analysis of partial-band interference effects on performance of FH/QFSK receiver under Rician Fading...
Just in few years, three-dimensional (3D) packaging technologies have attracted much more attention. With the development of through-silicon via (TSV) technology, silicon-based device integrations have become the main stream of 3D packaging technologies. In this study, the assembly of high performance processor chip and TSV interposer is developed. From bottom to top assembly process was applied and...
This paper presents an approach that combines the linear decreasing weight particle swarm optimization (LDWPSO) algorithm with crowding distance diversity maintenance to solve the multiobjective optimization problem (LDW-MPSO) for the optimal grade transition of continuous polymerization process. In the case study of a free radical styrene polymerization in a pilot continuous stirred tank reactor...
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