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Optimizing the elelctroplating condition, the thickness of a Pd layer in the Au/Pd/Ni/Cu pre-plated leadframe (PPF) is reduced to 8 -10 nm. Introducing a ~10 nm thick dense (Cu,Ni)3Sn intermetallic compound (IMC) layer in the PPF drastically reduces Cu out-diffusion and hence improves significantly the protection of the leadframes against oxidation and corrosion attack. The microstructural characterization...
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