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Heat dissipation has become one of the biggest challenges to improving the performance, reliability and power density of electronic devices. One of the crucial components in electronics packaging that must be further developed to address this challenge is thermal interface materials (TIMs). Recently, packed SiO2 nanoparticles, which could serve as TIMs when embedded in a polymer matrix, have been...
Additive manufacturing (AM) has received a great deal of attention for the ability to produce three dimensional parts via laser heating. One recently proposed method of making microscale AM parts is through microscale selective laser sintering (μ-SLS) where nanoparticles replace the traditional powders used in standard SLS processes. However, there are many challenges to understanding the physics...
Wireless Sensor Network (WSN) paradigm is an integral component of ubiquitous computing and Machine-to-Machine communications. Since WSNs are widely used in homeland security, military applications, next generation power lines, critical infrastructure monitoring and smart spaces, they are naturally attractive to the adversaries and vulnerable to natural conditions because of their harsh topologies...
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