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A silver nanoparticle based die attach material was used in a pressure free process to bond 2.5mm square Ag plated Si die to Ag and Au plated substrates. The assemblies were stored at 300°C for up to 500h and the morphology of the sintered Ag and the shear strength were monitored as a function of time. On Ag substrate it was found that die shear strength increased and that the Ag grains grew in size...