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Fatigue crack propagation for copper/epoxy molding compound interfaces is modeled in this work by conducting cyclic loading on double cantilever beam test specimens. The continued increase in mechanical compliance of test specimens as the crack propagates through hundreds of cycles is used to determine the crack length and thus, the crack growth rate per cycle which is used to determine the Paris’...
The objective of this work is to develop a combinedmode I and mode III characterization method and to use thistest method to study Copper (Cu) / Epoxy mold compound(EMC) interfacial delamination from near-mode I to nearmodeIII global loading. Using the developed test method, aseries of experiments are done with varying loading modeconditions from near-mode I to near-mode III and successfuldelamination...
Emerging fan-out packages require advances in mold compounds, polymer interfaces to metals and silicon, and innovative processing to reach the required high reliability. In this paper, we discuss the fracture energy for mold compound interface to copper and silicon, and use that information for studying interfacial delamination propagation of mold compound. We have examined mold compound delamination...
Bimaterial interfaces, like the one consisting of epoxy mold compound (EMC) cured over copper leadframe, are commonly present in microelectronic packages. Failure in such bimaterial interfaces can be simulated through the use of cohesive zone modeling (CZM). To date, nearly all CZM modeling of bimaterial interfaces has been performed for monotonic loading conditions. However, most of the interfacial...
Most microelectronic packages consist of multilayered structures made of dissimilar materials. Therefore, interfacial delamination is a common failure mechanism due to the mismatch in the coefficient of thermal expansion (CTE) between dissimilar materials. Epoxy mold compound (EMC) atop a copper leadframe is commonly used in microelectronic packages. Environmental factors such as high temperature...
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