The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, the bond interface of Al-1 wt.%Si wire bonded on Au/Ni/Cu pad at atmosphere temperature was analyzed by using high resolution transmission electron microscopy. Nano-scale characteristics at bond interface indicated that elemental aluminum diffusing into gold layer was with the feature of step-level periodicity. Due to exceeding solid solubility limit, intermediate Au8Al3 phase penetrated...
Due to small bond size, short bonding time, especially slight interface reaction, bonding details cannot be recognized using scanning electron microscope and energy density X-ray spectrum. In order to understand the physical mechanism of ultrasonic wedge bonding, in this paper, bond interface of ultrasonic AlSi wire wedge bonding on Au/Ni/Cu pad was investigated under high resolution transmission...
Considering two kinds of the most widely used wire bonding pads of the COB and BGA packaging styles, the characters of the bond interfaces in Al-Ni and Al-Au systems were compared after high temperature storage test through SEM observation. It was found that, according to the appearance, the Al-Au bond aged at 250degC in air for more than 40 days was expanded badly, and surface cracks were severe,...
Ultrasonic wedge bonding, which can be done at room temperature, is widely used in microelectronic package. It is primarily used to bond either Al wire or Au wire. After bonding and aging, the joint cross-section of 25mum Au wire bonded on Al metallization pad was analyzed by SEM with EDX. It is found that, there was evident diffusion of Au and Al, and Au5Al2 intermetallic compound (IMC) formed first...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.