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A 462-pin PGA (pin-grid-array) package that has 636- mu m pin pitch is described. The package substrate and heat sink are made of AlN ceramic. An LSI chip is attached directly on the heat sink. The package has a thermal impedance of less than 0.1 degrees C/W because of the high thermal conductivity of AlN. Further, the thermal coefficients of expansion of AlN and Si are closely matched. The package...
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