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As the applications of micro electronic mechanical system (MEMS) are booming, more and more research and development activities are involved in the MEMS industry. For every new MEMS product with new functions, the manufacturing process will be tailored to cope with the changes. This requires reliability work to ensure the robustness of the new process. Thus, failure analysis plays an important role...
As an alternative bonding interconnect material to gold wire, copper wire technology is getting more attention in assembly processes for its excellent electrical and thermal performance. Copper wire bonding meets lots of challenges because of its free air ball hardness, such as Al extrusion, pad crack/damage, reliability and low yield issue. General speaking, there are two ways to improve the issue...
Au-Ag alloy wire is a low cost wire bonding solution instead of gold wire for IC packaging. Comparing with copper wire, Au-Ag wire has better productivity because it does not need protective gas and it is softer. The main issue of Au-Ag alloy wire bonding is its reliability in humidity environment. In present study, the bond parameters effect on PCT reliability was investigated. The correlation between...
In web service composition (WSC), quality of service (QoS)-based web services selection has been a critical research issue, and many service selection methods have been presented aiming at resolving this issue, However, most of the existing methods ignore giving a risk evaluation for critical web services in WSC where transactional requirements often require compensation cost to ensure failure atomicity...
Due to the large-scale and long running of scientific computation under the dynamic and unsteady grid architecture, the capability of fault-tolerance of scientific workflow management system becomes more and more important. In order to handle inevitable failures of activities in workflow, we present a three-level recovery strategy in this paper: in the service level, we provide a distributed Service...
Service composition is becoming a prevalent way to building service-oriented business applications (SOBAs). In an open service environment, the profit of composition (PoC) is a primary concern of building such applications. How to improve the PoC is a significant issue in developing SOBAs but was largely overlooked by current research. Particularly, the modeling and prediction of PoC should play a...
In tins paper, the effect of a new type of pad structure in which the copper pad is half etched with OSP surface finish on board level thermal cycle reliability of BGA is evaluated comparing conventional flat pad with ENIG surface finish. The test data is presented, including resulting Weibull analyses indicating characteristic life. The solder joint with flat pad Ni/Au surface finish has a little...
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