The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The advances of flip-chip technology have driven the development of both underfilling processes and underfill materials. With the flip chip scaling to fine pitch and small gaps, nano-sized filler has become an alternative choice to conventional micron-sized filler for underfill applications. On one hand, due to the large surface area of the nanofiller, polymer based nanocomposites exhibite improved...
For electronic packaging applications, polymer based SiO2 composites with low CTE and low elastic modulus are of great importance to the thermal or mechanical stress relief and reliability improvement. However, it's still a great challenge to achieve these goals simultaneously by incorporating conventional SiO2 filler into resin matrix. In this study, we prepared the mesoporous SiO2 filler through...
Anhydride and amine epoxy systems are widely used as hardeners in underfill materials for flip chip packaging. A comparison was made between these two systems in order to evaluate the comprehensive performance of the resulting underfill. It was found that the addition of multi-size silica particles has little effect on the curing reaction of the epoxy mixture while a significant effect on increasing...
In our study, three different silane coupling agents with various functional groups, (y-aminopropyl) triethoxysilane (KH550), γ-(2,3-epoxypropoxy) propytrimethoxysilane (KH560) and trimethoxyoctadecylsilane (TMOS) were added into the SiO2/epoxy composites respectively, and their effects on the rheological and thermomechanical properties of nanocomposites were investigated systematically. The incorporation...
In our study, three different silane coupling agents with various functional groups, (y-aminopropyl) triethoxysilane (KH550), γ-(2,3-epoxypropoxy) propytrimethoxysilane (KH560) and trimethoxyoctadecylsilane (TMOS) were added into the SiO2/epoxy composites respectively, and their effects on the rheological and thermomechanical properties of nanocomposites were investigated systematically. The incorporation...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.