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The authors demonstrate a Ni/Cu bilayer structure for the under-bump-metallization (UBM) in Sn-Ag flip chip solder joints to enhance the electronmigration lifetime. The Ni layer provides two main contributions for the lifetime improvement. First, since Ni is a good diffusion barrier for Cu, it reduces the electromigration failure by UBM dissolution. Furthermore, the Ni layer limits the current crowding...
It is well known that Ni and its alloys possess a lower reaction rate with Sn than Cu and Cu alloys. Therefore Ni-based under bump metallization have attracted attention in recent years. In this study, the diffusion-controlled reaction between eutectic Sn-3.5Ag flip chip solder joints between electroplated-Ni (EP-Ni) and electroless-Ni (EL-Ni) has been investigated. Morphology and growth kinetics...
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