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In micro-electro-mechanical systems (MEMS) technology, one of the conventional patterning methods used for metallic thin films is the lift-off process using a photoresist material. However, there is concern regarding the photoresist material generating gas due to the long-term annealing or the high power used in sputter deposition. Thin-film amorphous alloys, such as thin-film metallic glass (TFMG),...
In this paper, we proposed a new fabrication method of thick film structure which has rectangular cross-sectional shape. This fabrication method utilized a new sputtering jig consisting of substrate and spacer units. The surface level of spacer unit is lower than one of substrate unit. After thick film deposition, the spacer unit is removed. In comparison with conventional sputtering and lift off...
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