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Pd-coated copper wire bonding is getting more practical applications in electronic packaging because of advantages, such as ease of use, better bonding performance and reliability. ENEPIG (Electroless Ni Electroless Pd Immersion Au) is a prevalent surface finish technique that can realize more flexible substrate design, increase wire density and hence achieve device miniaturization. Study had been...
Fine-pitch backside via last through silicon via (TSV) process flow is demonstrated as a qualified candidate to be used in the construction of 3D-IC structure. Glue and its bonding conditions are critical to the final yield of the process. Different glues and temporary bonding conditions are investigated to find out the optimized stable process flow. Different daisy chain lengths are used to evaluate...
An interconnecting technology using a Au-Au thermocompressive bond has been successfully developed for microelectromechanical system (MEMS) heterogeneous chip integration in this paper. The Daisy chain and RF transition structures are both designed and fabricated for the electrical characterization of the interconnect scheme. Measured dc contact resistance is about 14 ??5 m?? for the bonding interface...
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