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Fatigue crack growth tests of lead-contained (Sn-37Pb) and lead-free (Sn-3.0Ag-0.5Cu) solders were conducted under frequencies ranged from 10 to 0.1Hz and a stress ratio of 0.1 at room temperature and 70°C. J-integral range (ΔJ) and modified J-integral (C*) were used fordiscussingabout cycle-dependent and time-dependent crack growth behavior forboth the solders. The experimental results showed that...