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This paper presents a novel in-liquid method to manipulate and micro-assemble MEMS in 3D by means of holographic optical trapping and hydrophobic interaction. Up to eight traps can be simultaneously generated with a trapping stiffness of 5 pN/μm each. SU8 cylinders (10μm diameter, 10μm-40μm height) were used as test MEMS, which could be translated with a speed of 6μm/s and rotated at 30 rpm. All forces...
In this paper we present the fabrication and characterization of highly sensitive cantilevers, with and without magnetic tip, used for magnetic resonance force microscopy experiments. The full wafer silicon batch microfabrication was successful and the achieved production yield was about 70%. Cantilevers have been characterized in vacuum, at room temperature, and revealed promising properties for...
Wafer scale nanostencil lithography is used to define 200 nm scale mechanically resonating silicon cantilevers monolithically integrated into CMOS circuits. We demonstrate the simultaneous patterning of ~2000 nano-devices by post-processing standard CMOS wafers using one single metal evaporation, pattern transfer to silicon and subsequent etch of the sacrificial layer. Resonance frequencies around...
In this paper, the fabrication and use of stencils for full-wafer scale shadow mask (stencil) lithography is described. The stencils fabricated via microelectromechanical systems are mechanically stabilized and show clearly reduced stress-induced membrane deformation, which translates into a more accurate surface pattern definition. Solid-state SiN membranes 500 nm thick and up to 1 mm2 in size having...
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