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A contactless power transfer system has a lot of attention in many advantages such as the electric shock free and the short circuit. Moreover, if assuming the electric supply to a moving vehicle, a contactless power transfer system is advantageous in respect of less maintenance. So a contactless power transfer system is expected to be applied to the power feeding to the electric vehicles and the railway...
Through chip electrodes for three-dimensional packaging can offer the short interconnection and reduced signal delay. Formation of suitable vias by electrodeposition into cavities presents a filling problem similar to that encountered in the damascene process. Because via dimensions for through-chip filling are larger and have a higher aspect ratio relative to features in damascene, process optimization...
Copper via filling is one of the most recent nanoscale electrodeposition technologies used in semiconductor fabrication. Sub micrometer vias on silicon wafers serve as digital signal conductors, when filled with copper. The additives in the electrodeposition bath are critical to obtain vias free of voids and defects. Current-voltage curves show that different additives have either inhibition or acceleration...
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