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In this paper, we present a study on protective coating techniques for thin film X-TEM sample preparation. The study shows that proper choice of the protective layer before FIB cross section is a crucial step to maintain the film profile and make sure the accuracy of the thickness measurement. Silicon native oxide is used as the target sample. We have investigated PECS metal sputtering followed by...
Although nano-particles have attracted extensive studies in material science and technology for decades, how to measure the particle size efficiently and conveniently still remains to be a problem unsolved. In this paper, Si nano-particles prepared by annealing a very thin amorphous Si layer were inspected by atomic force microscopy (AFM) as well as SEM and TEM e-beam techniques. Results extracted...
EELS chemical bond analysis has been used to characterize etching process induced plasma damages in low-k SiCOH materials. EELS can provide not only the information of element distribution, but also the insight of chemical bonding status. Through applying the Maximum-likelihood deconvolution to EEL spectra, minor but critical changes in EELS core loss near edge fine structures can be clearly revealed...
This paper presents a configurable CONCORD platform for Multi-Project System-on-a-Chip (MP-SoC) implementation. The multi-projects platform was created for integrating heterogeneous SoC projects into a single chip. The total silicon prototyping cost for these projects can be greatly reduced by sharing the common SoC platform. A configurable SoC prototyping platform CONCORD is created as a verification...
This paper describes a novel technique for covering microfluidic systems using Parylene-C. Microfluidic systems consisting of micro channels and reservoirs need to be covered to protect or isolate liquid samples from the environment. Thick photoresist and wax are employed as the sacrificial layers in the enclosed micro channels and reservoirs before Parylene-C sealing. The results show that the melted...
Vertical optical mode-size transformation from 260nm-thick Si-nanowaveguide to 10~12μm matching the single-mode-fibre-core has been demonstrated using compact multilayer Si/SiO2 asymmetric GRIN lens (length:~24μm). GRIN lens to single-mode-fibre practical coupling loss of -3.45 dB was achieved.
Stretchable electronics and sensors have been attracting significant attention due to their unique characteristics and wide applications. This paper demonstrates a prototype of a fully stretchable temperature sensor on an elastomeric substrate. The sensor was first fabricated on a silicon-on-insulator (SOI) wafer and then transferred to a pre-strained elastomeric polydimethylsiloxane (PDMS) substrate...
We present a novel room temperature bonding technique using reactive multilayer Ni/Al foils as local heat sources to heat intermediate adhesion layers and thus bond silicon wafers to form wafer level package. Exothermic reactions in Ni/Al multilayer foils were investigated by X-ray diffraction (XRD) and differential scanning calorimetry (DSC). XRD measurements showed that the dominant product after...
On-die capacitance is critical parameter in power delivery analysis and design, which impacts design cost and system performance. To improve modeling accuracy, correlation was studied for on-die capacitance among internal algorithm/tool, on-die PDA, Apachepsilas RedHawk and lab measurement. Internal tool, on-die PDA is a tool to automatically simulate on-die models including Cdie, Rdie and Icc(t)...
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