Search results for: Bo-In Noh
Microelectronics Reliability > 2014 > 54 > 2 > 410-416
Metals and Materials International > 2014 > 20 > 3 > 515-519
Microelectronics Reliability > 2013 > 53 > 12 > 2036-2042
Microelectronic Engineering > 2013 > 103 > Complete > 1-6
Journal of Materials Science: Materials in Electronics > 2012 > 23 > 1 > 41-47
Microelectronic Engineering > 2011 > 88 > 6 > 1024-1027
Microelectronic Engineering > 2011 > 88 > 5 > 718-723
Journal of Alloys and Compounds > 2011 > 509 > 9 > L153-L156
Journal of Electronic Materials > 2011 > 40 > 9 > 1950-1955
Journal of Electronic Materials > 2011 > 40 > 2 > 224-231
Journal of Electronic Materials > 2011 > 40 > 1 > 35-41
Journal of Materials Science: Materials in Electronics > 2011 > 22 > 1 > 84-90
Journal of Materials Science: Materials in Electronics > 2011 > 22 > 7 > 745-750
Journal of Materials Science: Materials in Electronics > 2011 > 22 > 7 > 790-796
Journal of Alloys and Compounds > 2010 > 506 > 1 > 331-337
Journal of Alloys and Compounds > 2010 > 499 > 2 > 154-159
Ieee transactions on components and packaging technologies > 2010 > 33 > 1 > 222 - 228
Ieee transactions on components and packaging technologies > 2010 > 33 > 1 > 64 - 70