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In this work, thermal and flow characteristics for the metallic foam heat sinks (FHSs) with the central impingement flow were studied with de-ionized water coolant. Such a flow configuration helps to reduce the pressure drop inherent for straight flow in porous foams. The reduction in the pressure drop is analyzed based on the one-dimensional porous medium model and verified with experimental measurement...
A 2.5D package is referred to as the packaging of multiple chips on an interposer made of silicon or glass featured with through-vias filled with copper as electrical interconnects. Thermal management remains a challenge due to the integration of dissimilar chips such as logic and memory chips on a common interposer in molded package format. In this paper, a partially molded 2.5D package (PM package)...
Device scaling and heterogeneous integration necessitate through silicon vias (TSVs) as interconnects for 2.5D and 3D chip packages for shortened signal transmission, less delay, and more functionality. Proper evaluation of the thermal properties of TSVs is a key to the successful design of the package. On the other hand, the determination of in-plane thermal conductivity is complicated with the thin...
In this paper, the analysis and modeling of a new type of liquid cooled heat sink are conducted. The heat sink is represented by alternating metallic foil layers with nearly honeycomb-shaped porous structure. The major advantage of this type of heat sink lies in the ease of fabrication with controllable geometrical parameters. The solid volume fractions and effective thermal conductivity in heat flow...
The neural networks identification model is developed on the basis of the force analysis of magnetic bearing spindle, which reflects the nonlinear delay character between inputs and outputs system. This network is able to converge quickly in 5 training steps. The mean square error value reduces to 3.495e-006 in 50 steps. Inspection shows that the neural networks DTNN identification model can fit the...
The use of CFD for thermal analysis in the design of electronic devices has proven to be cost effective and time saving in the ever decreasing product development life cycle, However when the product involves components with several orders of magnitude in length scales, and comprises many fine features which may not be easily simplified because of their random nature, the ability to predict an accurate...
Six Sigma is a set of systematic statistical tools for improving the quality of the process. Control charts as the last stage of the major Six Sigma methodology show great importance in not only maintaining the process but also improving the process. In this paper, a type of advanced control chart, EWMA chart is proposed to monitor the Weibull distributed TBE data. The recommended Box-Cox transformation...
Functional burn-in testing has become one of the major benchmark testing for computer processors recently. In this study, the air flow modeling and simulation in functional burn-in systems have been conducted with multiple fans for convection dominated thermal enhancement. In the tray-level modeling, the duct tray with three mother boards and dual processors are constructed with the thermal head on...
Fluid velocity fields and particle motions were experimentally studied for the application of microfluidics in chip-based cell assays. muPIV measurements were conducted on diverging microchannels and a microfluidic cell trapping device to characterize the respective fluid flow fields. A highspeed camera was then used to capture and characterize the motion of particles released into the corresponding...
Despite its recognized essentiality for assessment of patient-specific physiopathological states, passive cardiac tissue conductivity remains largely unexplored in inverse electrocardiography (IECG) studies. In this paper, we present a novel framework for simultaneous recovery of the volumetric myocardial conductivity and electrophysiological dynamics from a posteriori image-derived heart- torso geometry...
In this paper, the synthesized experiments and analysis of microchannel heat sinks (MCHSs) in electronic packaging are presented. Microchannel heat sinks together with the flip chip ball grid array (FCBGA) packages were characterized with water and FC-72 as the coolants. Experiments were conducted by reducing the flow rate at a fixed power input in both normal setup with upward heating and inverted...
Experimental characterization of FC-72 flow boiling in a microchannel heat sink is presented for three different orientations: vertical upflow (VU), vertical downflow (VD) and horizontal flow with horizontal facing (HH). The heat sink consisted of 21 microchannels in parallel, with the channel dimensions of 0.2mm (W) times 2mm (H) times 15mm (L). The heat sink was attached onto a flip chip BGA package...
Summary form only given. Here we report the study of nonlinear optical effects and waveguide modes of wide-bandgap and band-gap tunable semiconductor GaN and Al/sub x/Ga/sub 1-x/N epitaxial films. Low-pressure metalorganic vapor deposition (MOCVD) was used to grow epitaxial GaN and AlGaN layers on (0001) sapphire substrate. The UV absorbance spectra of a GaN film (with thickness 2.1 /spl mu/m) is...
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