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Device scaling and heterogeneous integration necessitate through silicon vias (TSVs) as interconnects for 2.5D and 3D chip packages for shortened signal transmission, less delay, and more functionality. Proper evaluation of the thermal properties of TSVs is a key to the successful design of the package. On the other hand, the determination of in-plane thermal conductivity is complicated with the thin...
Experimental characterization of FC-72 flow boiling in a microchannel heat sink is presented for three different orientations: vertical upflow (VU), vertical downflow (VD) and horizontal flow with horizontal facing (HH). The heat sink consisted of 21 microchannels in parallel, with the channel dimensions of 0.2mm (W) times 2mm (H) times 15mm (L). The heat sink was attached onto a flip chip BGA package...
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