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In this paper, the synthesized experiments and analysis of microchannel heat sinks (MCHSs) in electronic packaging are presented. Microchannel heat sinks together with the flip chip ball grid array (FCBGA) packages were characterized with water and FC-72 as the coolants. Experiments were conducted by reducing the flow rate at a fixed power input in both normal setup with upward heating and inverted...
Experimental characterization of FC-72 flow boiling in a microchannel heat sink is presented for three different orientations: vertical upflow (VU), vertical downflow (VD) and horizontal flow with horizontal facing (HH). The heat sink consisted of 21 microchannels in parallel, with the channel dimensions of 0.2mm (W) times 2mm (H) times 15mm (L). The heat sink was attached onto a flip chip BGA package...
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