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We present a new scheme of buffer implementation in through-silicon via (TSV) based 3D circuits at early layout design stage for total delay minimization. For optimal buffer insertion at floorplanning level, it is important to incorporate more accurate and realistic estimation of interconnect delay and power. Early prediction of delay and power leads to better design decisions, overall timing closure...
The next generation of digital subscriber line (DSL) standard will require the development of enabling technologies to exploit currently unused higher frequencies in the very and ultra high frequency bands over a shorter copper drop. At these higher frequencies, the indirect channels produced by the electromagnetic coupling (EMC) between pairs in a binder cable may be as strong as, or stronger than,...
A very important challenge in designing through-silicon via (TSV)-based 3D ICs is to accurately estimate, through all stages of the physical design, the interconnect delay which is strongly dependent on the layout of 3D IC. The earlier in the design process and more accurate it can be done; the better design decisions can be made. Incorporating an optimal buffer insertion approach in the early layout...
We propose a new scheme of dynamic nets-to-TSVs assignment during floorplanning for 3D-ICs. A nontrivial area occupied by TSVs, their physical dimensions, location on the layout and the nets-to-TSVs assignment, are some of the key factors influencing the wirelength, TSV count and chip area, and consequently, impact the total delay. We address the above issues by simultaneous placement of TSV islands...
3D technology facilitates reduction in wirelength by vertically stacking dies. Through-silicon-vias (TSVs) are used to connect inter-die signals, and the RC value of a single TSV depends on TSV dimensions, technology and used materials. The impact of TSVs on the delay also depends on the interaction between neighboring TSVs, on the length of wires connected to TSVs, and physical parameters of metal...
3D integration is considered as one of the most promising solutions to improve energy efficiency of heterogeneous ICs. We use floorplannning tools to evaluate power consumption related to inter-block connections for digital ICs implemented as 2D and 3D systems. We focus on 3D stacking using through-silicon-vias (TSVs). We evaluate contributions of wires, buffers and TSVs based on information available...
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