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Stitch crack is a recurring failure mechanism for many years in semiconductor packaging. Currently, the combination of highly filled mold compounds, and copper wire increases the risk for stitch cracks after temperature cycling (TC). Firstly, highly filled mold compounds generally have a Coefficient of Thermal Expansion (CTE) that is much lower than that of copper, and a much higher elastic modulus...
We present a robust method for measuring the cure shrinkage of dispensable organic films in-situ. Samples consist of dispensed organic material (e.g. die attach or underfill) sandwiched between a glass substrate and a silicon die. A Thermal Mechanical Analyzer (TMA) was used to accurately measure the displacement of the die during cure, and to control the temperature. An analytical model has been...
Summary form only given. The ever increasing complexity and function integration of microelectronic products in combination with the decreasing design margins, the decreasing time-to-market, and ever increasing gap between technology advance and fundamental knowledge opposes a severe challenge for the microelectronics industry to meet the quality, robustness, and reliability requirements of their...
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