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As drop-induced failures are most dominant in handheld electronic products, enhancing the anti-dropping performance of fine-pitch ball grid array (FBGA) package, which are currently popular in handheld electronic products is very important. In this paper, the anti-dropping performance of Fine-Pitch BGA package is evaluated with respect to their solder joint reliabilities after drop impacts test experiment...
Cu is commonly used as filling material for TSV in 3D integration [1]. However, there is a problem of thermal mismatch between Cu and Si, and also there is still space for improvement in electrical resistivity. In order to improve the physical properties of TSV electroplating copper, we added high conductivity and low expansion coefficient nanoparticles such as graphene to the copper plating solution...
In this paper, we examine the changes of the firm's financial and operational performances after horizontal M&A, and further analyze the role of the operational performance, from the perspective of supply chain integration. Through the collection of 523 M&A samples from 2005 to 2013, we match the firms' performances of one year before, one year after and two years after the completion of the...
In this work, current stress was applied to investigate electromigration (EM) effects for Cu/Sn/Cu solid-state-diffusion (SSD) bonding in 3D integration. Full-array bumps with different pitches were fabricated on wafers. Asymmetric structure of Cu/Sn bump and Cu bump was deposited by low-cost electroplating process. With optimized surface pretreatment, wafer-level Cu/Sn/Cu SSD bonding was performed...
Software-managed architectures, which use scratch-pad memories (SPMs), are a promising alternative to cached-based architectures for multicores. SPMs provide scalability but require explicit management. For example, to use an instruction SPM, explicit management code needs to be inserted around every call site to load functions to the SPM. such management code would check the state of the SPM and...
As the number of cores increases, cache-based memory hierarchy is becoming a major problem in terms of the scalability and energy consumption. Software-managed scratchpad memories (SPM) is a scalable alternative to caches, but the benefit comes at the cost of explicit management of data. For instance, an instruction SPM needs a code management techniques to load code blocks to the SPM. This paper...
Phase autofocus is a key step of translational motion compensation (TMC) in inverse synthetic aperture radar (ISAR). In this paper, an effective phase autofocus algorithm for ISAR is proposed based on single eigenvector. Samplings in multiple range bins are used to construct the covariance matrix and obtain the eigenvector corresponding to the largest eigenvalue. It is found that this eigenvector...
Co-P films with thicknesses of 3.5 and 12.5 µm were used as metallization in Sn-Ag-Cu/Co-P ball grid array solder joints. The solder joints were annealed at 150°C up to 1000 h. The growth and mechanical properties of interfacial intermetallic compounds (IMCs) in the Sn-Ag-Cu/Co-P joints were studied, and the influence of Co-based IMCs on the shear strength of the Sn-Ag-Cu/Co-P joints was analyzed...
A novel low temperature wafer-level Cu-Cu bonding method using Ag nanoparticles (NP) was proposed and realized in this paper. A bonding structure consisted of Cu bonding pads, TiW barrier/adhesive layer was firstly fabricated on the silicon wafer. Ag NPs were then deposited by physical vapor deposition (PVD) on Cu pads. The morphology of Ag NPs annealed at different temperature was studied. Bonding...
MIS (Molded Interconnect System) substrate, as a type of coreless substrate, has the advantages of lower profile and higher electrical performance. However, warpage would be one of the major concern without the mechanical support of the core material. In this study, warpage of multilayered MIS substrate has been simulated using finite element analysis (FEA). Coefficients of thermal expansion (CTE)...
The design, assembly and testing of a multi-sensor platform that could be used to detect specific parameters of ambient environment is presented in this paper. This platform will be packaged using System-Level integration and could be used as one of the nodes in a sensor network. It is composed of commercial off-the-shelf components, which allows low cost and flexible component selection. The sensors...
Cu protrusion is a widely known challenge in through silicon via (TSV) fabrication which occurs because of the large mismatch in the coefficient of thermal expansion (CTE) between Cu and silicon. The leakage current of TSVs is the major electrical characteristic related to reliability of TSV. In this paper, Cu protrusion reliability was analyzed by Thermal Cycling (TC) test. A testing vehicle for...
This paper presents a novel design of a tunable tri-band bandpass filter using varactor-tuned stub-loaded resonators. The first and the third passband center frequencies of the proposed tri-band filter can be independently tuned by controlling the different values of the capacitances and different varactor diodes, whereas the second passband center frequency is fixed. A prototype tri-band filter is...
Scratchpad-memory (SPM) based memory hierarchy is a promising alternative to cache-based memory hierarchies, due to the difficulty in scaling caches to processors with high core count. However, explicit data management in software is required on SPM-based memory hierarchies. This paper focuses on optimizing the stack data management on SPM-based multicore processors, as memory accesses to call stack...
Header compression can effectively improve the bandwidth utilization, especially in satellite links which have limited bandwidth. The existing header compression schemes compress packet headers from network layer. In OpenFlow network, MAC header can play a role in routing since forwarding rules can be dynamically deployed based on input port, IP/MAC addresses etc. Moreover, it is not necessary to...
Consider a supply chain setting consisting of a manufacturer and a supplier, in which the former can invest to reduce the latter's production cost, but the cost information is proprietary to the latter. Whether the supplier commits to share his information will have an influence on the manufacturer's investment. Therefore, this paper investigates the relationship between the manufacturer's investment...
Measurable but controllable disturbances are common in industry, which drive systems away from their references and take time for feedback control to reject them, especially when the systems present input-output delays due to mechanical properties. In this paper, a novel feedforward control based on disturbance prediction is proposed. Besides, to compensate system responses to disturbance prediction...
In this work, Ar mixed 5% H2 plasma was applied to improve the surface properties of electroplated Cu and electroplated Sn for Cu/Sn/Cu solid-state-diffusion (SSD) bonding in 3D interconnection. The surfaces of electroplated Cu and electroplated Sn were easily covered with a thin oxide layer which would reduce the surface activity and degenerate the bonding performance. With an optimal pretreatment...
Contents Classical control theory is appropriate for dealing with single-input-single-output (SISO) systems but becomes powerless for multiple-input-multiple-output (MIMO) systems because the graphical techniques were inconvenient to apply with multiple inputs and outputs. Since 1960, modern control theory, based on time-domain analysis and synthesis using state variables, has been developed to cope...
Contents Chapters 2–4 mainly focus on multivariable system analysis. From this chapter onwards, several design methods for multi-loop/multivariable PID control are presented. Based on the loop paring criterion proposed in Chapter 2, this chapter goes further to seek a simple but effective design method for decentralized PID controllers.
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