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CSP (Chip scale package) LEDs have drawn intensive attention lately since it provides multiple times power density than traditional packages. Higher power density brings possibilities of better light control and more industrial applications in UV LED applications. Therefore, a chip scale LED package of 2.0 × 1.6 mm, named 2016, has been designed and fabricated for UV applications. The LED package...
Dome lens formation method through dispensing highly thixotropic encapsulant [1] has been introduced into LED industry for several years. It's cost-effective and concise in production flow, but not qualified yet when accurate optical properties are needed. Most of directional fixtures therefore require LED packages with precisely molded dome lenses, which need complex and expensive processes. In this...
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