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For improvement of the productivity and the cost reduction, FOWLP (fan-out wafer level package) or FOPLP (fan-out panel level package) process using large-sized substrate has been actively developed in recent years. Above all, we will report about the novel TCB (thermal compression bonding) equipment which is even applicable to a 3D-IC stacking process and a fine pitch FOWLP or FOPLP of RDL-first...
As one of the methods to stack the 3D-IC fast, the collective bonding process using TCB (thermo-compression bonder) attracts attention [1-3]. In the collective bonding process, we can improve the throughput considerably by postbonding the multilayered pre-bonded chips at a time. However, when the number of the stacked chips increased, we found that the temperature difference between the upper layer...
Second harmonic 266nm generation was demonstrated by periodically-poled LaBGeO5 (PP-LBGO) with 2nd-order QPM structure. More than 15mW of 266nm was obtained from nanosecond-pulsed 532nm laser. Circular beam at 266nm without walk-off was obtained.
Monolithic Fan-out PPMgSLT device is demonstrated to generate third harmonic generation from 1064nm laser. By integrating single and fan-out QPM structures into one device, 100mW of third harmonic was obtained without any critical tunings.
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