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This paper describes a novel wafer-level integration and packaging technology for a chip-size-packaged integrated tactile sensor. A MEMS wafer and a CMOS wafer were bonded with a thick (50μm thick) BCB (benzocyclobutene) adhesive layer, and a capacitance gap for capacitive force sensor is formed between the wafers. The large thickness of BCB is advantageous to capacitively isolate the CMOS circuit...
This paper describes a novel integration and packaging process for a chip-size-packaged integrated tactile sensor. A MEMS wafer and a CMOS wafer were bonded with a thick (50 µm thick) BCB (benzocyclobutene) layer, which also works as the dielectric layer of sensing electrodes. The large thickness is advantageous to reduce parasitic capacitance to the CMOS circuit. The thick BCB layer was formed on...
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