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In this paper, a fast correction algorithm is proposed for laser marking based on SOPC(System On Programmable Chip) system. The principle of figure distortion and correction algorithm for laser marking is analyzed in detail while correction algorithm is implemented by SOPC. By taking advantage of SOPC system which supports the design of software and hardware in coordination, the embedded processor...
An 11.3Gb/s CMOS SONET-compliant transceiver is designed to work in both RZ and NRZ data formats. The TX driver exhibits 17ps rise/fall times, 0.25psrms RJ, and 2pspp DJ. The RX has a multi-stage vertical threshold adjustment circuit. It achieves 5mVpp-diff RX input sensitivity with 0.54UI jitter tolerance. The transceiver core area occupies 1.36mm2 in 65nm CMOS and consumes 214mW.
Network-on-chip (NoC) can improve the performance, power efficiency, and scalability of multiprocessor system-on-chip (MPSoC). However, traditional NoCs using metallic interconnects consume significant amount of power to deliver even higher communication bandwidth required in the near future. Optical NoCs are based on CMOS-compatible optical waveguides and micro resonators, and promise significant...
Networks-on-chip (NoCs) can improve the communication bandwidth and power efficiency of multiprocessor systems-on-chip (MPSoC). However, traditional metallic interconnects consume significant amount of power to deliver even higher communication bandwidth required in the near future. Optical NoCs are based on optical interconnects and optical routers, and have significant bandwidth and power advantages...
Multiprocessor system-on-chip (MPSoC) is an attractive platform for high-performance applications. Networks-on-chip (NoCs) can improve the on-chip communication bandwidth of MPSoCs. However, traditional metallic interconnects consume significant amount of power to deliver even higher communication bandwidth required in the near future. Optical NoCs are based on CMOS-compatible optical waveguides and...
The self-alignment motion of optical fiber is critical to the low-cost and high-precision direct-coupling technology in optoelectronic packaging. In this research, the self-alignment method by using surface tension of molten solder and by adopting specific pad shape was proposed. First, the self-alignment model of solder joint in fiber attachment soldering was developed by using the public domain...
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