The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The drawbacks of commonly applied color treatment based on the HSI space model have been identified as being the additional computation load for color model conversion, which results in compromising the real-time traffic sign detection. The relevant analysis shows that the major factor adversely affecting the segmentation of traffic signs is closely associated with the color complexity. To reduce...
The integrated power technologies intends to integrate devices and functions in Moore's law with the ones in More-then-Moores directions. The technology, where integrating power MOSFET together with high quality passive analog component and high speed digital processor is possible, requires effort to enhance analog and high V low Ron MOSFET in process and design support. The advantage of foundry technology...
The payload oscillation inherent to all cranes makes it challenging for human operators to manipulate payloads quickly, accurately, and safely. A new type of crane control system that allows an operator to drive a crane by moving a hand-held wand has been implemented on an industrial bridge crane at the Georgia Institute of Technology. An image processing system tracks the movement of the wand and...
We report a compact coherent receiver front-end consisting of an integrated 4·40 arrayed-waveguidegrating array following a polarization-diversity hybrid for complete demodulation of a 1.12-Tb/s multi-carrier-signal having 10·112-Gb/s PDM-QPSK subchannels, achieving 17-dB required OSNR/subchannel at BER=10−3.
A low temperature C2W (Chip to wafer) bonding method is developed for integrating MEMS and electronics into a wafer level package. The diced known good MEMS chip is picked and bonded onto an ASIC wafer using an In based low temperature solder below 200 degC. The C2W bonded MEMS and ASIC wafer is sealed with a cap wafer. The sealed package is characterized for hermeticity and shear strength and found...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.