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It is increasingly apparent that the traditional scene graph is not fulfilling the requirements of real-time interactive systems. The use of a single graph as a representation of the current state of the world means that display systems, that may operate at very different rates, or may need to predict ahead the state, need to be very tightly integrated with behaviour and semantics. In this position...
3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. Key technologies for realizing 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnections. The major bottleneck for 3D integration are thermal management issues due to the reduced thermal spreading in...
3D stacking of dies is a promising technique to allow miniaturization and performance enhancement of electronic systems. Key technologies for realizing 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnections. The complexity of these structures combined with reduced thermal spreading in the thinned dies complicate the...
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