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The complexity and extra cost associated with a resist topcoat (TC) layer has motivated the industry to transition to TC-less resist processes. By switching to TC-less resists, track suppliers are able to achieve higher throughput using less costly equipment, scanner suppliers can increase the scanning speed of their litho systems with minimized risk of defects, and end users eliminate a process step...
Enhanced resolution capability, defined in Rayleigh's criterion as: R = (k1*lambda)/NA (1); where R = minimum resolution, lambda = exposure wavelength, and k1 = process dependent factor is the key motivation for the transition to immersion lithography, and the continued push for higher numerical apertures (NA). Regardless of the imaging enhancements made possible by immersion lithography though, this...
In this paper, we report results of comprehensive studies of defects originating in immersion photolithography clusters comprising immersion volume production tool (S609B, NA=1.07) and engineering evaluation tool (EET NA = 0.85). Defectivity S609B was very low, 0.013 cm2 it attained dry exposure level successfully. Defectivity results using EET were also very promising in all three major resist processes...
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