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Grain size modulation in Cu interconnects was achieved at an elevated anneal temperature of 250 °C. As compared to the conventional annealing at 100 °C, the elevated process enabled further Cu grain growth, which then resulted in an increased grain size and improved electromigration resistance in the Cu interconnects. In order to prevent stress migration reliability degradation from the elevated annealing...
Soil degradation and retrogression have been widely concerned in China in the last several decades due to inadequate utilization, application of various agrochemicals and pesticides, soil pollution, rapid urbanization, and frequent human activities. Degradation of agricultural soils may not only result in some health risks to soil ecosystems, but also affect food quality and safety. This study was...
As the current-carrying capability of a copper line is reduced due to interconnect dimension shrinkage, self-aligned CoWP metal-cap has been reported to be helpful to improve degraded electromigration (EM) reliability. However, adoption of the metal cap in general further exacerbates the already problematic low-k dielectric TDDB reliability at 32nm and beyond. This paper provides a comprehensive study...
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