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System power integrity characterization for low-power high-speed memory interface in a 3D package system is a challenging task due to probing difficulties imposed by small form factor. In this paper, power integrity measurements including supply noise, PSIJ sensitivity and PDN impedance curve using on-chip noise generator and monitors are presented. On-chip measurement data are validated by off-chip...
Characterization of I/O channels in 3D package systems is quite challenging as it is difficult to observe signal quality. A traditional way of measuring each device in a component level does not capture complex interaction in 3D integration. Although a sense line can be designed to externally measure noise on power lines, it is not feasible for signal lines as it significantly alters the signal quality...
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