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This study addresses the mechanics of the relatively brittle solder/intermetallic (IMC) interface fracture process using damage mechanics concept. The damage state, ?? of a material point in the solder/IMC interface, is expressed in terms of orthogonal traction components in a quadratic failure criterion of a cohesive zone model. The model is then employed in a finite element analysis of a solder...
In this study, cohesive damage zone model is evaluated and employed to model solder/intermetallics (IMC) interface crack initiation and propagation in solder interconnects. Interface materials damage is quantified in terms of stress-to-strength ratios of orthogonal components in a quadratic failure criterion along with a mixed-mode displacement formulation for crack initiation event. Subsequent crack...
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