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Tin film about one micron thick was electroplated over a silicon wafer pre-coated with a layer of Cr and another layer of Ni by evaporation. A special sample holder was designed to apply compressive stresses in the electroplated tin film. After incubation in a vacuum oven at 160degC for 7 days, huge hillocks about 10-30 mum diameter and 30-150 mum length grew with a density about 7 per square mm....
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