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A widely adopted multilevel converter topology is the cascaded H-bridge (CHB), as it can provide voltage and power scalability. However, since the CHB converter can be composed by cells with different remaining lifetime, it could be useful to delay a fault of higher aged cells in order to prolong the entire converter's lifetime. In this paper, a thermally compensated discontinuous pulse width modulation...
In technology of electronic packaging, demands of miniaturization and high-density in electronic systems has sustainably grown. Therefore, it have been required to develop the technology of three dimensional (3D) stacking using through silicon via (TSV) Technology. The TSV technology is an interconnection method by filling an electric conductive material in via hole after via formation. Cu as a filling...
The benefits shown in the reliability performance when using the low Ag solder in BGA package has been known due to its intrinsic characteristic. In this study, SAC alloy with the dopant D1 and D2 respectively are selected to compare with the widely-used solder alloy, SAC105, from the perspective of the thermal fatigue fracture. The 0.5mm-pitch TFBGA packages on Halogen-free FR4 PCB pre-treated at...
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