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This article deals with solders wettability measurement of materials with different surface finishes, which are commonly used as solder pads on printed circuit board. The measurement was carried out on two type of solders (Sn63Pb37, Sn95,5Ag3,8Cu0,7), two types of fluxes (94-RXZ-M (IPC-ANCI-J-STD-004 - REL0), 323-ITV (C-ANCI-J-STD-004 - REL1)) and as testing material we used one-side plating PCB (FR4)...
This article deals with the mechanical stress of lead free soldered joints. During usage of electrical equipment are found structural changes of soldered joints, which can lead to cracks or failure of the solder joints. Therefore solder joints have influence on a total quality of electronic assembly. Mechanical tests are mainly used for resistance evaluation of components, devices and whole products...
Network formation during copolymerization of styrene with a model bismaleimide, p-maleimidobenzoic anhydride, or with mixtures of p-maleimidobenzoic anhydride and methyl p-maleimidobenzoate was studied. The concentrations of pendent double bonds in copolymers, calculated from the consumption of monomers and copolymer composition, follow the general trend typical for vinyl-divinyl copolymerizations...
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