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We have investigated the electrical properties of anisotropic conductive adhesive (ACA) joint using submicrometer-sized (~500 nm in diameter) silver (Ag) particle as conductive filler with the effect of π-conjugated self-assembled molecular wires. The ACAs with submicrometer-sized Ag particles have higher current carrying capability (~3400 mA) than those with micro-sized Au-coated polymer particles...
Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests as environmentally friendly materials in electronic packaging industry because they are lead-free, require fewer processing steps, such as fluxing and cleaning (reducing processing cost), allow a low processing temperature (enabling the use of heat-sensitive and low-cost components and substrates), and fine pitch...
Silver migration has long been one of the most critical issues in semiconductor electronic industry, while no effective approaches have been developed to control silver migration and maintain its excellent electrical and thermal properties. In this paper, we report a novel approach of using molecular self-assembled monolayers (SAMs) to dramatically reduce silver migration in the nano-Ag conductive...
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