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The growth kinetics and morphology of the interfacial intermetallic compound (IMC) Cu6Sn5 between Sn-3Ag-0.5Cu-xFe (x= 0, 0.5wt.%, 1wt.%) composite solders and Cu substrate during aging were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250 °C and then aged at 150 °C. The Fe element tended to suppress the growth of the Cu3Sn layer...
With the development of surface mount technology, solders are required for applications that require high reliability and dimensional stability. Composite solders, reinforced with particles in a conventional solder alloy, is an attractive and potential method. This study presents series results on the binary eutectic Sn-Bi composite solders reinforced with Cu6Sn5 particles (0.5wt.% and 1wt.%). With...
The electromigration (EM) behavior of 300 μm Sn-3.0Ag-0.5Cu solder bumps on Au/Ni-P substrate metallization in flip chip package was investigated at 150°C with a current density of 5×103 A/cm2. After reflowing for three times, the massive spalling of original intermetallic compound (IMC) of (Cu,Ni)6Sn5 was observed on the chip side. After aging and EM at 150°C for 200 h, the initial intermetallic...
Growth kinetics and interfacial morphologies of the intermetallic compound (IMCs) between Sn-3Ag-0.5Cu-xFe(0, 0.5wt.%, 1wt.%) composite solders and Cu substrates were investigated by reflowing for different durations at 250degC. Fe particles were deposited quickly in the vicinity of IMCs of the as-reflow samples due to the higher density of Fe than that of Sn-Ag-Cu. They formed a region about 30mum...
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