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Growth kinetics and interfacial morphologies of the intermetallic compound (IMCs) between Sn-3Ag-0.5Cu-xFe(0, 0.5wt.%, 1wt.%) composite solders and Cu substrates were investigated by reflowing for different durations at 250degC. Fe particles were deposited quickly in the vicinity of IMCs of the as-reflow samples due to the higher density of Fe than that of Sn-Ag-Cu. They formed a region about 30mum...
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