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We have developed a CMP process providing a short polishing time and sufficient uniformity that is applicable to 300 mm scale carbon nanotube (CNT) via integration. To achieve our target, we have developed a new CMP process to make selectively grown CNT in a via hole. Spin on carbon (SOC)film was coated to protect nickel (Ni) catalyst and titanium nitride (TiN) film inside the via hole during SOC-CMP...
We fabricated a carbon nanotube (CNT) via structure on a 300-mm wafer. We investigated the CNT chemical-mechanical polishing (CNT-CMP) behavior in an actual via pattern structure and clarified the technical issues of the CNT-CMP process. We developed a fabrication process of CNT via structures using selective CNT growth, which has a high potential for applying CNTs to high aspect ratio via structures.
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