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A novel method for producing high permeance, Pd/Cu alloy membranes in the fcc phase is presented. The deposition of sub-micron layers of Cu by electroless plating and Pd by the galvanic displacement of Cu on top of an already dense Pd membrane enabled an fcc Pd/Cu alloy to be present on just the surface of the membrane. The result was a Pd/Cu/Pd tri-layer that when annealed formed the sulfur resistant...
In this work, time‐resolved, in situ high‐temperature X‐ray diffraction was used to study the solid‐state transformation kinetics of the formation of the fcc Pd/Cu alloy from Pd/Cu bilayers for the purpose of fabricating sulfur‐tolerant Pd/Cu membranes for H2 separation. Thin layers of Pd and Cu (total ∼15 wt % Cu) were deposited on porous stainless steel with the electroless deposition method and...
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