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Chinese Fusion Engineering Testing Reactor (CFETR) is a superconducting Tokamak reactor. In order to research and validate the technology of Central Solenoid (CS) superconducting coils for CFETR, a Central Solenoid Model Coil (CSMC) has been designing and constructing, which is made of Nb3Sn/NbTi and operated by forced-flow cooling with supercritical helium (SHe). In this paper, the process of cryogenic...
Product design is the key to attract consumers in fashion. To enhance product image, many E-commerce marketplaces may provide re-design innovation service to enhance the products' original design according to the marketplaces' promotion themes. The extant literature shows that the better quality of re-design innovation can attract more consumers to buy products in the e-commerce marketplaces. In this...
In order to extend the performances of integrated circuit (IC), new bonding approaches are being explored. Since copper has good electrical and thermal conductivity, and relatively low cost, it is widely used as the bonding material for advanced packaging. Unfortunately, the normal direct copper-to-copper bonding demands relatively high temperature, which greatly limits its applications. A low temperature...
The Central Solenoid (CS) model coil of China Fusion Engineering Test Reactor (CFETR) consists of an inner Nb3Sn module and an outer NbTi module. In this paper, a Fortran code is written to do the optimization design, which is performed with aim of reducing the Nb3Sn CICC conductor required to produce a peak field of 12 T, besides the length of NbTi CICC conductor and the height difference among the...
Unstacking is a process widely used in many industrial applications. This paper proposes an automatic unstacking system using an industrial robot and stereo vision. To detect a package to be picked, a shape-based matching (SBM) method is applied on 2D images. The 3D position of a selected package among pick-up candidates is calculated by acquiring a pair of correspondence points in the left and right...
To realize low temperature thermocompression bonding for 3D packaging and integration is of great significance. This research focuses on Cu-Cu low temperature thermocompression bonding using nanoporous copper films (NPCf) as bonding layer. Cu-Zn alloy as the precursor alloy was fabricated on the ceramic substrate by means of heating-alloy method, then the precursor alloy was immersed into the dilute...
Low temperature bonding technology has been a research hotspot in recent years due to its success of avoiding impurities interdiffusion, minimizing thermal stresses between heterogeneous materials, minimizing voids and other defects, and reducing the cost. In this work, a novel low temperature thermocompression bonding technology using nanoporous Cu (NPC) was proposed and the influences of different...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
Low temperature bonding technology has been a research hotspot in recent years due to its success of avoiding impurities interdiffusion, minimizing thermal stresses between heterogeneous materials, minimizing voids and other defects, and reducing the cost. In this work, a novel low temperature thermocompression bonding technology using nanoporous Cu (NPC) was proposed and the influences of different...
Nanoporous metals fabricated by dealloying have been utilized in a wide variety of applications including catalysis, sensors and actuators as well as low temperature bonding. In this work, nanoporous copper (NPC) for low temperature bonding was prepared by selectively dissolving Zn atoms from the Cu-Zn alloy, and the influences of electroplating time of Zn and dealloying duration on the characteristics...
Real-time monitoring of elderly movement can provide valuable information regarding an individual's degree of functional rehabilitation. Many laboratory-based studies have described various gait detection systems with different wearable inertial sensors, but only limited number of papers addressed the issues by using some non-wearable sensors. A practical method of gait information detection and gait...
To realize low temperature thermocompression bonding for 3D packaging and integration is of great significance. This research focuses on Cu-Cu low temperature thermocompression bonding using nanoporous copper films (NPCf) as bonding layer. Cu-Zn alloy as the precursor alloy was fabricated on the ceramic substrate by means of heating-alloy method, then the precursor alloy was immersed into the dilute...
This paper models two structures for simulating the resistance electric field dependence of piezoresistor in silicon pressure sensor. The difference of the two structures is one with a shield layer and the other one without it. The simulation results show that the shield layer can shield the electric field no matter where it origins externally or it is caused by fixed oxide charges, which is very...
In this paper, a novel substrate for white light LED (light emitting diode) is presented, the silicon substrate in which silicon wafer with cavities and TSVs (through silicon via). The fabrication process begins with double-side polished 4-inch silicon wafer. Firstly a silicon dioxide layer with 0.8um thickness is formed on the silicon wafer through thermal oxidation. Then the photo-resistor layer...
Light emitting diodes (LEDs) hold the promise for efficient, lightweight and environmental-friendly lighting sources, which is regarded as the next-generation lighting technology. Since so many problems still remain to be solved, this emerging technology has attracted the attention of a large number of researchers. Among several issues frequently discussed in the community, the long-time reliability...
As one type of the chip attachment materials, the solder layer inside the light-emitting diode (LED) packages can not only bond the chips to the substrate tightly, but also play the role of thermal interface material (TIM). Therefore, it makes a great influence on the thermal performance LED packages, especially in high density chip-array LED packaging. The solder layer has become one of the dominant...
The phenomenon that phosphor particles tend to settle in silicone is widely known. Recent researchers have discussed the effects of phosphor concentration on luminous efficacy of LED packaging. But to produce reliable products, mechanical and interfacial considerations are also essential. In this paper, the mechanical behaviors and interfacial strength of silicone with different levels of phosphor...
In recent years, LEDs are applied in many novel illumination fields, and LED airport runway centerline lamp is a relatively new application in airfield lighting. While such lamps used in the runway of airport have strict requirements including mechanical reliability and optical illumination requirement, such as color, luminous intensity and incident angle etc [1, 2]. As we all know, there exists strong...
As the most promising candidate for the realization of high-efficiency light sources for general lighting, the high power lighting emitting diodes (LEDs) still have reliability issues that hinder the large scale application of LED devices. Nowadays, the reliability is becoming an essential barrier for LED devices to substitute the traditional light sources. Before it is applied into mass production,...
A measuring method of hip and knee joint angles based on omni-directional lower limb rehabilitation platform is proposed. Several ultrasonic modules are vertically fixed inside the rehabilitation platform, the relative distances between the ultrasonic modules and surface of each lower limb are detected circularly in walk process, hip and knee joint angles at any time are obtained according to the...
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