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A MEM based electrostatic field sensor is presented which uses capacitive interrogation of an electrostatic force deflected microstructure. Experimental measurements showed successful detection of a switched DC electric field. A sensitivity of 16 kV/m was demonstrated with the capacitive interrogating electrode located 27 µm away. Performance analysis of a this sensor structure showed low field measurement...
Due to scale effects, the releasing of micro objects has been a long-standing challenge in micromanipulation applications. In this paper a micromanipulation system is presented based on the adhesion control with compound vibration. This adhesion control technique employs inertia force to overcome adhesion force achieving 100% repeatability with releasing accuracy of 4±0.5μm, which was experimentally...
As the endeffectors of micromanipulation systems, microgrippers are crucial point of such systems for their efficiency and their reliability. So the steady and reliable performance of the microgripper is needed. In this work, a hybrid-type electrostatic silicon microgripper integrated vacuum tool is designed and fabricated to realize the steady gripping and reliable placing manipulations. This hybrid-type...
This work is focused on design and fabrication of a four arms structure MEMS gripper integrated sidewall piezoresistive force sensor. Surface and bulk micromachining technology is employed to fabricate the microgripper from single crystal silicon wafer (i.e., no silicon on insulator wafer is used). Vertical sidewall surface piezoresistor etching technique is used to form the side direction force sensors...
This paper presents the design, fabrication, and application of an electrostatically driven microgripper integrated piezoresistive force sensor. The microgripper is designed to manipulate two microobjects at the same time with force sensing ability. Surface and bulk micromachining technology is employed to fabricate the microgripper from single crystal silicon wafer. The end effector of the gripper...
Presented is a MEMS probe-card with ultra dense two dimensional (2-D) probe arrays for wafer-level IC test. About 110000 probe tips can be simultaneously fabricated in a 4-inch wafer, with the 2-D tip pitch as 240 mum times 160 mum. The "hoe-shaped" microprobe structure is composed of one or two planar arms and an up-tilted tip, both of which are high-yield fabricated by metal micromachining...
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